中文|ENG
R818

四核智能带屏语音芯片

产品

芯片框图

R818

基本规格

CPU

Quad-core ARM Cortex-A53 up to 1.6GHz
32KB L1 I-cache + 32KB L1 D-cache per core, 512KB L2 cache
Low-power CoolFlex power management architecture

GPU

GE8300 500MHz
Supports OpenGLES1.1/2.0/3.2, Vulkan1.1, OpenCL1.2

Memory

32-bit DDR4/DDR3/DDR3L/LPDDR3/LPDDR4
eMMC 5.0
8-bit TLC/MLC/SLC/EF NAND flash
SPI Nand flash

Audio

Supports two audio DAC and two audio ADC
Supports two analog audio inputs and two analog audio outputs
Stereo Speaker and capless stereo headphone driver
Four I2S controllers for connecting Bluetooth and external audio codec
Integrated digital microphone supports maximum 8 digital microphones

Process

28nm HPC+

Display

Supports one channel MIPI DSI output, 4-lane, up to 1920×1200@60fps
Supports LVDS output with dual link, up to 1920×1200@60fps
Supports RGB interface with DE/SYNC mode, up to 1920×1200@60fps
Supports size up to 2048x2048, with two video layer and two UI layer
SmartColor2.0 post processing for an excellent display experience

Video

Supports H.265 decoder 4k@30fps
Supports H.264 decoder 1080p@30fps
Supports VP8 decoder 1080p@60fps
Supports H.264 HP encoder 1080P@60fps
Supports MJPEG encoder 4k@15fps
Supports JPEG encoder 13M

Camera

Compliant with MIPI-CSI2 V1.00 and MIPI DPHY V1.00.00
2 MIPI CSI input, 4 data lane and 2 data lane, up to 1Gbps per Lane in HS
Maximum to 8M@30fps or 13M@10fps, with 4 data lane
Supports format: YUV422-8bit/10bit, YUV420-8bit/10bit, RAW-8, RAW-10, RAW-12, RGB888, RGB565

ISP

Up to 8M@30fps or 13M@10fps, can be config as dual 1080p@60fps
Adjustable 3A functions, including AE, AWB and AF
Supports spatial(2D) de-noise filter
Supports contrast enhance and sharping
Supports chrominance noise reduction
Supports defect pixel correction

Security

Supports Symmetrical algorithm: AES, DES, 3DES, XTS, SM4
Supports Hash algorithm: MD5, SHA, HMAC, SM3
Supports Asymmetric algorithm: RSA, ECC, SM2
Supports PRNG and TRNG
Supports 2K-bit EFUSE for chip ID and security application

Connectivity

USB 2.0 OTG and HOST, SDIO 3.0, GMAC
SPI×3, TWI×5, 6xUART×6, PWM×5
IR TX, IR RX, LEDC, GPADC, LRADC

PMIC

AXP803 (w.charger)
AXP806 (wo.charger)

Package

LFBGA 346balls
12mm x 12mm size,0.5 ball pitch,0.3 ball size

OS

Android 10

方案亮点

四核ARM Cortex-A53架构
四核ARM Cortex-A53架构
丽色系统:SmartColor
丽色系统:SmartColor
H265 4K@30fps 视频解码
H265 4K@30fps 视频解码
800万单摄像头,或500万+200万双摄像头
800万单摄像头,或500万+200万双摄像头
28nm工艺,BGA 12mm x 12mm封装
28nm工艺,BGA 12mm x 12mm封装
工规质量保障
工规质量保障

典型机型

R818

相关新闻

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